1. 2. 3. material content data sheet sales product name bcr 553 e6327 issued 29. august 2013 ma# MA000238832 package pg-sot23-3-4 weight* 9.08 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip non noble metal arsenic 7440-38-2 0.000 0.00 15 noble metal gold 7440-57-5 0.013 0.14 1438 inorganic material silicon 7440-21-3 0.112 1.23 1.37 12283 13736 leadframe non noble metal chromium 7440-47-3 0.009 0.10 995 inorganic material silicon 7440-21-3 0.001 0.01 66 non noble metal titanium 7440-32-6 0.003 0.03 332 non noble metal copper 7440-50-8 3.001 33.04 33.18 330382 331775 wire noble metal gold 7440-57-5 0.021 0.23 0.23 2313 2313 encapsulation organic material carbon black 1333-86-4 0.091 1.00 10001 inorganic material antimonytrioxide 1309-64-4 0.136 1.50 15002 plastics brominated resin - 0.170 1.88 18752 plastics epoxy resin - 1.419 15.63 156270 inorganic material silicondioxide 60676-86-0 3.861 42.50 62.51 425054 625079 leadfinish non noble metal tin 7440-31-5 0.136 1.50 1.50 15019 15019 plating noble metal silver 7440-22-4 0.110 1.21 1.21 12078 12078 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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